In recent years, according to the output composition, the main products of PCB industry in China have changed from single panel and double panel to multi-layer panel, and are upgrading from 4-6 to 6-8 or more. With the rapid growth of multi-layer board, HDI board and flexible board, China's PCB industrial structure is gradually being optimized and improved.
Printed circuit board (PCB) is the most active industry in the modern electronic component industry. Its growth rate is generally higher than that of the electronic component industry by about 3 percentage points. According to the analysis of various factors, it is expected that the rapid growth will be maintained in 2006. Demand upgrading and industrial transfer are the basic driving forces to promote the development of the industry, while HDI board, flexible board, IC packaging board (BGA, CSP) and other varieties will become the main growth points.