Any PCB circuit board will be attached with a detailed description of the surface treatment process of pcb. It has a direct impact on the selection of the surface treatment process of PCB and the quotation of the product. Of course, different process treatments have their advantages and disadvantages. The most important thing is to see where the product is applied. Let's understand the shortcomings of the common surface treatment process of PCB. What are the following:
PCB Circuit Board Manufacturing
1. OSP is highly susceptible to acid and humidity. PCB needs to be treated by a new surface treatment after storage for more than three months. It will be used up within 24 hours after opening the package. OSP is an insulating layer. Solder paste is needed to be printed at the test point to deal with the original OSP layer before contacting the needle point for electrical testing.
2. Hot air leveling-pins with fine clearance and too small components are not suitable for welding. Due to poor surface smoothness of PCB tin spray board, tin beads are easy to appear in PCB processing, and it is also easy to form knowledge for pin components with fine clearance.
PCB processing
3. Chemical Silver Deposition - Not only the cost of PCB board is high, but also the welding performance is not very good. Using the process of non-electroplating nickel, the black disc will be formed easily, and the nickel layer will be oxidized with time. Long-term reliability is also a problem.
4. Electroplating nickel and gold-PCB plate treated by electroplating nickel and gold process, the color is slightly inferior to that of gold, and the color is not as bright as that of other processes.